FINITE ELEMENT INVESTIGATION OF HEAT TRANSFER ENHANCEMENT IN MICROCHANNEL HEAT SINKS FOR ELECTRONICS COOLING
Department of Electrical & Electronics Engineering,
Global Horizon Institute of Technology, India
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High‑density electronic devices generate significant heat, which adversely affects performance, reliability, and lifespan. Microchannel heat sinks (MCHS) have emerged as a promising thermal management solution due to their high surface area‑to‑volume ratios, enabling efficient heat dissipation in compact spaces. This research leverages Finite Element Method (FEM) based comprehensive analysis to evaluate heat transfer behavior in microchannel heat sinks, exploring effects of geometric configurations, fluid flow parameters, and working fluids on thermal performance. The study examines various enhancement techniques such as ribbed channels, wavy walls, and hybrid cooling methods through detailed simulation using ANSYS Fluent and COMSOL Multiphysics. Results reveal enhancements in heat transfer coefficients and thermal resistance reduction, with implications for optimizing next‑generation electronic cooling solutions. Comparative evaluations are presented to guide design choices and future experimental validation.
The analysis highlights the critical role of microchannel geometry in influencing flow distribution and thermal gradients within the heat sink. Additionally, the selection of working fluids, including nanofluids and phase-change materials, demonstrates notable improvements in convective heat transfer rates. These findings provide a foundation for developing optimized MCHS designs tailored to specific electronic cooling requirements..
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Choudhary, V. R. & Sharma, R. N. (2025). Finite Element Investigation of Heat Transfer Enhancement in Microchannel Heat Sinks for Electronics Cooling. International Journal of Science, Strategic Management and Technology, Volume 01(03), 1-9. https://doi.org/10.55041/ijsmt.v1i3.001
Choudhary, Vikram, and Rohit Sharma. "Finite Element Investigation of Heat Transfer Enhancement in Microchannel Heat Sinks for Electronics Cooling." International Journal of Science, Strategic Management and Technology, vol. Volume 01, no. 03, 2025, pp. 1-9. doi:https://doi.org/10.55041/ijsmt.v1i3.001.
Choudhary, Vikram, and Rohit Sharma. "Finite Element Investigation of Heat Transfer Enhancement in Microchannel Heat Sinks for Electronics Cooling." International Journal of Science, Strategic Management and Technology Volume 01, no. 03 (2025): 1-9. https://doi.org/https://doi.org/10.55041/ijsmt.v1i3.001.
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